Today, SMT chip processing technology has been more and more widely used in the electronics industry. In order to realize the miniaturization, thinner, lighter and more functions of electronic products, the requirements for circuit board design are becoming more and more strict, and the technical requirements are also getting higher and higher.

Today, SMT chip processing technology has been more and more widely used in the electronics industry. In order to realize the miniaturization, thinner, lighter and more functions of electronic products, the requirements for circuit board design are becoming more and more strict, and the technical requirements are also getting higher and higher. There must be strict processing technology. Today, the editor of Tongsen Electronics will introduce the processing process of SMT patch to you.

1. First of all, there must be a detailed patch position map before SMT chip processing. Our customers of Xingenyu Electronics are required to provide samples, and design, develop and compile relevant programs according to the samples provided.

2. Before soldering electronic components, solder paste should be stenciled on the pads. These all require screen printing machine processing.

3. SMT chip processing In order to fix the electronic components on the PCB so that it is not easy to loosen, it must be glued on the fixed position of the PCB board.

4. Then install the electronic components to be assembled on the PCB according to the position on the drawing by the placement machine.

5. Melt the patch glue on the PCB, so that the PCB board and the assembled electronic components are better pasted together, and it is not easy to fall off with touch and shaking.

6. After SMT chip processing and welding, a lot of residues will be left on the PCB board, which is harmful to the human body and affects the quality of the PCB. Therefore, it is necessary to remove them, and use flux to remove them.

7. After the completion, it is also necessary to check whether the assembly position is accurate, the quality after assembly, and whether it is qualified. The inspection needs to be carried out with the help of magnifying glass, microscope, functional tester and other related measurement tools.

8. If a fault is found after the SMT chip processing inspection, it is necessary to rework, reorganize, check the position, etc.