SMT in SMT chip processing, also known as surface mounting technology or surface mounting technology, is the abbreviation of Surface Mounted Technology, and it is also a popular processing technology in the electronic processing industry. SMT chip processing is to process on the basis of PCB circuit board, and install components on the PCB. The following briefly introduces the common steps of SMT chip processing.

1. Solder paste printing: This link is usually in the front section of the patch processing production line. The main function is to print the solder paste or patch glue on the pads of the PCB through the stencil to prepare for the welding of the components.

2. Dispensing: The main content of the dispensing operation is to drop the glue to the fixed position of the PCB, and its main function is to fix the components on the PCB board.
 

3. Patch: The role of the patch link in SMT patch processing is to accurately mount the surface mount components in the fixed position of the PCB. The equipment used is a patching machine, which is usually differentiated based on the speed and accuracy of the patching.

4. Curing: The main function is to melt the patch glue, so that the surface mount components are firmly bonded to the PCB board.

5. Reflow soldering: The main function of reflow soldering is to melt the solder paste, so that the surface mount components are firmly bonded to the PCB board. In SMT chip processing, the reflow soldering process is directly related to the soldering quality of the circuit board. The temperature profile of reflow soldering is also one of the important parameters of SMT processing.

6. Cleaning: Its function is to remove soldering residues such as flux that are harmful to the human body on the assembled PCB.